Tech News

• Ryzen 9 9950X3D Review @ GURU3D

  Published: Wednesday, April 2, 2025 | By: Guest

  Guru3D recently released a comprehensive review of the AMD Ryzen 9 9950X3D, emphasizing its remarkable performance in both gaming and multitasking scenarios. Designed for high-end users, this processor boasts 16 cores and 32 threads, paired with AMD’s innovative 3D V-Cache technology to boost memory throughput and minimize latency.

  According to the review, the Ryzen 9 9950X3D delivers top-tier gaming performance across a wide range of titles, frequently surpassing rival CPUs in benchmark results. The enhanced cache structure contributes to higher frame rates and faster load times, offering a smoother and more responsive gameplay experience.

  

  Beyond gaming, the CPU proves highly capable in demanding productivity workloads, including video editing, 3D rendering, and development environments. Its impressive power efficiency supports sustained performance under heavy use, with minimal risk of thermal throttling.

  Guru3D also commends the chip’s seamless integration with tools like AMD Ryzen Master, allowing users to fine-tune performance and monitor system health. Altogether, the Ryzen 9 9950X3D stands out as a powerful and versatile solution for enthusiasts and professionals alike.

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• Acer RX 9070 Nitro OC @ LanOC Reviews

  Published: Tuesday, April 1, 2025 | By: Guest

  LANOC recently published a comprehensive review of the Acer RX 9070 Nitro OC graphics card, highlighting its impressive performance and thoughtful design. This high-end GPU delivers outstanding gaming capabilities, driven by a powerful architecture and an advanced cooling system engineered for efficiency and stability.

  In both benchmark testing and real-world gaming scenarios, the RX 9070 Nitro OC demonstrated strong performance, with high-speed memory enabling smooth gameplay at elevated resolutions. Its custom heatsink and multi-fan configuration ensure effective thermal management, minimizing the risk of thermal throttling during extended use.

  

  "For AMDs upcoming GPU launch there had been rumors for months but this past week AMD confirmed that they were launching both the Radeon RX 9070 and Radeon RX 9070 XT. Both cards being their first RDNA 4 architecture cards. Today the performance embargo for both cards lifts and we can check out how they perform ahead of them hitting stores tomorrow. So let's dive in and find out how they compare to yesterday's announced RTX 5070 and more!"

  The card also supports popular software tools such as MSI Afterburner for performance tuning and features Mystic Light RGB for customizable lighting, enhancing the visual appeal of any build.

  Overall, LANOC concludes that the Acer RX 9070 Nitro OC is a compelling option for gamers seeking top-tier performance, reliable cooling, and enhanced customization features.

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• AMD Ryzen 9 9950X3D Review @ Vortez

  Published: Tuesday, April 1, 2025 | By: Guest

  Vortez recently published an in-depth review of the AMD Ryzen 9 9950X3D processor, emphasizing its outstanding performance and advanced features. Engineered for high-performance computing, this flagship CPU offers 16 cores and 32 threads, enhanced by AMD’s 3D V-Cache technology to optimize both gaming and multitasking efficiency.

  The review highlights the processor’s exceptional gaming performance, frequently matching or outperforming competitors in benchmark tests. The addition of 3D V-Cache significantly improves memory bandwidth and latency, resulting in faster load times and smoother gameplay.

  

  "AMD's Ryzen 9 9950X3D is the latest addition to the company’s high-performance CPU lineup, designed to push the limits of gaming and productivity. Built on the Zen 5 architecture, this processor features 16 cores, 32 threads, and a high clock speed, making it a powerful option for demanding users."

  Beyond gaming, the Ryzen 9 9950X3D proves highly capable in productivity applications, excelling in rendering, video editing, and software development. Its impressive power efficiency ensures consistent performance under sustained workloads, minimizing the risk of thermal throttling.

  Vortez concludes that the Ryzen 9 9950X3D offers an excellent value proposition, making it a compelling choice for gamers and professionals seeking top-tier performance.

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• ASUS ProArt X870E-Creator Wi-Fi @ TechPowerUp

  Published: Monday, March 31, 2025 | By: Guest

  TechPowerUp published a review of the ASUS ProArt X870E Creator WiFi motherboard lately, highlighting its robust features and performance. This high-end board supports AMD Ryzen processors and includes advanced cooling solutions like ProCool II power connectors and VRM heatsinks for stable operation under heavy workloads.

  The review notes the impressive connectivity options, including Wi-Fi 6E, USB 3.2 Gen 2x2 Type-C ports, and a Thunderbolt 4 port, making it ideal for seamless data transfers and connectivity. Additionally, the board features extensive RGB lighting control through the Aura Sync ecosystem, aligning with the growing trend of aesthetic customization in motherboard designs.

  

  "Arguably one of the best-looking motherboards out there, but what does the latest ProArt motherboard for AMD Ryzen CPUs bring to the table, considering its high price tag? Is it worth it compared to the competition, even for creators?"

  TechPowerUp praises the user-friendly BIOS interface and comprehensive software suite, such as AI Suite III and ProArt Creator Hub, which enhance productivity and customization options. At our website, we appreciate the resurgence of decorative elements in motherboard design, as it allows users to create not only powerful but also visually stunning PC builds.

  Overall, the ASUS ProArt X870E Creator WiFi is a top choice for content creators seeking superior performance and advanced features.

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• ASUS ProArt Z890-Creator WiFi Z890 Motherboard Review @ APH Networks

  Published: Monday, March 31, 2025 | By: Guest

  APH Networks recently published a review article for the ASUS ProArt Z890-Creator WiFi motherboard, highlighting its premium design and creator-focused features. Built on the Intel Z890 chipset and LGA1851 socket, it supports Intel’s latest Core Ultra Series 2 processors and up to 256GB of DDR5 memory. The board includes five M.2 slots, dual PCIe 5.0 x16 lanes, and robust connectivity options such as Thunderbolt 5, 10Gb Ethernet, Wi-Fi 7, and Bluetooth 5.4. With a sleek black-and-gold finish, extensive BIOS tuning, and a price around $490, APH Networks praised it as a solid, high-end choice for creative professionals and enthusiasts.

  

  "The ASUS ProArt Z890-Creator WiFi is a powerful and well-designed Z890 motherboard loaded to the brim with features all in a professional looking package..."

  
  It would seem the ArtDeco scene is back.  Sadly, on this motherboard it will be hidden behind your massive video card and blinding ARGB lights.  But, at least you will know that you have a professional grade motherboard for making graphics even better.
  
  
  

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• G.SKILL Unveils High-Capacity, Low-Latency DDR5-6000 CL26 48GBx2 Memory Kit for AMD AM5 Platform

  Published: Sunday, March 30, 2025 | By: Guest

  (19 March 2025) – G.SKILL International Enterprise Co., Ltd., the world’s leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96GB (48GBx2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

  

  High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5

  G.SKILL continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96GB (48GBx2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen™ 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen™ 9 9900X desktop processor.

  Fine Tuning: DDR5-6000 CL26-36-36 2x24GB
  Following the previous announcement of the DDR5-6000 CL26-39-39-96 at 48GB (24GBx2) kit capacity, G.SKILL is updating this specification with an even lower tRCD and tRP latency of DDR5-6000 CL26-36-36-96 at 48GB (24GBx2) – making it an ideal choice for the latest compatible AMD AM5 platforms. Refer to the Memtest validation screenshot below on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen™ 9 9900X desktop processor.

  Overclock Profile Support & Availability
  These new DDR5 specifications comes with AMD EXPO (Extended Profile for Overclocking) technology for easy memory overclocking via the motherboard BIOS on supported platforms, and will be offered under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 Neo RGB memory series. These memory kits will be rolling out to G.SKILL worldwide distribution partners starting in May 2025.

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• ASRock Radeon RX 9070 Steel Legend OC Graphics Card Review @ ThinkComputers.org

  Published: Friday, March 28, 2025 | By: Guest

  Tech media outlet ThinkComputers recently published an in-depth review of the ASRock Radeon RX 9070 Steel Legend OC graphics card. Based on AMD’s Navi 48 architecture, this factory-overclocked model features 3,584 stream processors and 16GB of GDDR6 memory on a 256-bit interface. It delivers a game clock of 2,210 MHz and a boost clock of 2,700 MHz, exceeding reference specifications. The card showcases a refined white aesthetic with RGB-illuminated triple-fan cooling, a full metal backplate, and a reinforced frame. Additional highlights include Polychrome SYNC, striped ring fans, and ultra-fit heatpipes, designed to ensure enhanced cooling performance and long-term durability.

  

  "AMD's Radeon RX 9000 series really has gamers excited. One of the main reasons for this is gamers actually have a viable second option when choosing a new graphics card. Since the introduction of NVIDIA's RTX 50 series was no competition at all, and with what some would call lackluster performance, phantom MSRPs, and no availability gamers where chomping at the bit for an alternative. Finally they have one in the Radeon RX 9070 series..."

  I just have to say, there was a time when companies felt the need to "name everything" If the product was new and unique a name like that would be perfect and would help to make it stand out in the marketplace.  If the name was good enough, it would become legend.

  However, calling your product "Steel Legend" and hoping for the same respect is laughable at best 
  

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• Micron Innovates From the Data Center to the Edge With NVIDIA

  Published: Thursday, March 27, 2025 | By: Guest

  Micron HBM3E 12H and LPDDR5X-based SOCAMM solutions designed to unlock full potential of AI platforms

  SAN JOSE, Calif., March 18, 2025 (GLOBE NEWSWIRE) -- GTC 2025 -- Secular growth of AI is built on the foundation of high-performance, high-bandwidth memory solutions. These high-performing memory solutions are critical to unlock the capabilities of GPUs and processors. Micron Technology, Inc. (Nasdaq: MU), today announced it is the world’s first and only memory company shipping both HBM3E and SOCAMM (small outline compression attached memory module) products for AI servers in the data center. This extends Micron’s industry leadership in designing and delivering low-power DDR (LPDDR) for data center applications.

  Micron’s SOCAMM, a modular LPDDR5X memory solution, was developed in collaboration with NVIDIA to support the NVIDIA GB300 Grace™ Blackwell Ultra Superchip. The Micron HBM3E 12H 36GB is also designed into the NVIDIA HGX™ B300 NVL16 and GB300 NVL72 platforms, while the HBM3E 8H 24GB is available for the NVIDIA HGX B200 and GB200 NVL72 platforms. The deployment of Micron HBM3E products in NVIDIA Hopper and NVIDIA Blackwell systems underscores Micron’s critical role in accelerating AI workloads.

  Think AI, think memory, think Micron
  At GTC 2025, Micron will showcase its complete AI memory and storage portfolio to fuel AI from the data center to the edge, highlighting the deep alignment between Micron and its ecosystem partners. Micron’s broad portfolio includes HBM3E 8H 24GB and HBM3E 12H 36GB, LPDDR5X SOCAMMs, GDDR7 and high-capacity DDR5 RDIMMs and MRDIMMs. Additionally, Micron offers an industry-leading portfolio of data center SSDs and automotive and industrial products such as UFS4.1, NVMe^® SSDs and LPDDR5X, all of which are suited for edge compute applications.

  “AI is driving a paradigm shift in computing, and memory is at the heart of this evolution. Micron’s contributions to the NVIDIA Grace Blackwell platform yields significant performance and power-saving benefits for AI training and inference applications,” said Raj Narasimhan, senior vice president and general manager of Micron’s Compute and Networking Business Unit. “HBM and LP memory solutions help unlock improved computational capabilities for GPUs.”

  SOCAMM: a new standard for AI memory performance and efficiency
  Micron’s SOCAMM solution is now in volume production. The modular SOCAMM solution enables accelerated data processing, superior performance, unmatched power efficiency and enhanced serviceability to provide high-capacity memory for increasing AI workload requirements.

  Micron SOCAMM is the world's fastest, smallest, lowest-power and highest capacity modular memory solution, designed to meet the demands of AI servers and data-intensive applications. This new SOCAMM solution enables data centers to get the same compute capacity with better bandwidth, improved power consumption and scaling capabilities to provide infrastructure flexibility.

  • Fastest: SOCAMMs provide over 2.5 times higher bandwidth at the same capacity when compared to RDIMMs, allowing faster access to larger training datasets and more complex models, as well as increasing throughput for inference workloads.
  • Smallest: At 14x90mm, the innovative SOCAMM form factor occupies one-third of the size of the industry-standard RDIMM form factor, enabling compact, efficient server design.
  • Lowest power: Leveraging LPDDR5X memory, SOCAMM products consume one-third the power compared to standard DDR5 RDIMMs, inflecting the power performance curve in AI architectures.
  • Highest capacity: SOCAMM solutions use four placements of 16-die stacks of LPDDR5X memory to enable a 128GB memory module, offering the highest capacity LPDDR5X memory solution, which is essential for advancements towards faster AI model training and increased concurrent users for inference workloads.  
  • Optimized scalability and serviceability: SOCAMM’s modular design and innovative stacking technology improve serviceability and aid the design of liquid-cooled servers. The enhanced error correction feature in Micron’s LPDDR5X with data center-focused test flows, provides an optimized memory solution designed for the data center.

  Industry-leading HBM solutions
  Micron continues its competitive lead in the AI industry by offering 50% increased capacity over the HBM3E 8H 24GB within the same cube form factor. Additionally, the HBM3E12H 36GB provides up to 20% lower power consumption compared to the competition's HBM3E 8H 24GB offering, while providing 50% higher memory capacity.

  By continuing to deliver exceptional power and performance metrics, Micron aims to maintain its technology momentum as a leading AI memory solutions provider through the launch of HBM4. Micron’s HBM4 solution is expected to boost performance by over 50% compared to HBM3E.

  

  Complete memory and storage solutions designed for AI from the data center to the edge
  Micron also has a proven portfolio of storage products designed to meet the growing demands of AI workloads. Advancing storage technology in performance and power efficiency at the speed of light requires tight collaboration with ecosystem partners to ensure interoperability and a seamless customer experience. Micron delivers optimized SSDs for AI workloads such as: inference, training, data preparation, analytics and data lakes. Micron will be showcasing the following storage solutions at GTC:

  • High-performance Micron 9550 NVMe and Micron 7450 NVMe SSDs included on the GB200 NVL72 recommended vendor list.
  • Micron’s PCIe Gen6 SSD, demonstrating over 27GB/s of bandwidth in successful interoperability testing with leading PCIe switch and retimer vendors, driving the industry to this new generation of flash storage.
  • Storing more data in less space is essential to get the most out of AI data centers. The Micron 61.44TB 6550 ION NVMe SSD is the drive of choice for bleeding-edge AI cluster exascale storage solutions, by delivering over 44 petabytes of storage per rack,⁸ 14GB/s and 2 million IOPs per drive inside a 20-watt footprint.

  As AI and generative AI expand and are integrated on-device at the edge, Micron is working closely with key ecosystem partners to deliver innovative solutions for AI for automotive, industrial and consumer. In addition to high performance requirements, these applications require enhanced quality, reliability and longevity requirements for application usage models.

  • One example of this type of ecosystem collaboration is the integration of Micron LPDDR5X on the NVIDIA DRIVE AGX Orin platform. This combined solution provides increased processing performance and bandwidth while also reducing power consumption.
  • By utilizing Micron’s 1β (1-beta) DRAM node, LPDDR5X memory meets automotive and industrial requirements and offers higher speeds up to 9.6 Gbps and increased capacities from 32Gb to 128Gb to support higher bandwidth.
  • Additionally, Micron LPDDR5X automotive products support operating environments from -40 degrees Celsius up to 125 degrees Celsius to provide a wide temperature range that meets automotive quality and standards.

  Micron will exhibit its full data center memory and storage product portfolio at GTC, March 17 – 21, in booth #541.

  

  About Micron Technology, Inc.
  Micron Technology, Inc. is an industry leader in innovative memory and storage solutions, transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron^® and Crucial^® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com. 

  To learn more about SOCAMM, Please visit: https://www.micron.com/products/memory/lpddr-modules/socamm 

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• Montech XR Wood @ TechPowerUp

  Published: Wednesday, March 26, 2025 | By: Guest

  TechPowerUp recently published a review article on the Montech XR Wood, a mid-tower PC case that blends modern performance with a touch of classic design. The review highlights its standout aesthetic, featuring a sturdy steel frame paired with elegant American Walnut wood accents on the front panel, offering a unique combination of durability and visual appeal.

  

  "The Montech XR Wood takes the same frame as the original XR but re-imagines it as a classic mid-tower. This basis gives it an extremely solid and competitive foundation. Montech has made sure to take advantage of that, designing the XR Wood to be even more intriguing..."

  The XR Wood comes equipped with four PWM ARGB fans—three 120 mm fans in the front and one 120 mm at the rear—delivering efficient airflow right out of the box. It supports flexible cooling configurations, including space for up to a 360 mm radiator in both the front and top panels. Internally, the case offers generous space for hardware installations, accommodating up to four 2.5" drives or two 3.5" drives. Thoughtful design touches, such as Velcro straps and grommeted pass-throughs, contribute to clean and effective cable management. The XR Wood is available in both black and white versions, catering to a range of style preferences.

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• New Variant: The 90° WireView Pro GPU by Thermal Grizzly

  Published: Wednesday, March 26, 2025 | By: Dennis

  With the 90° WireView Pro GPU, Thermal Grizzly Holding GmbH introduces a new version of the popular tool for measuring the power consumption of graphics cards. The 90° WireView Pro GPU shares all key features with the WireVire Pro GPU version, including internal and external temperature sensors as well as a sensor pin detection system for the 12VHPWR power connector. These, along with the acoustic alarm, are designed to protect the graphics card from damage. The main difference of the 90° variant is that the power supply cable is routed downwards toward the bottom of the case when the GPU is installed horizontally.

   

  
  
  
  The WireView GPU Series was developed in collaboration with Jon “elmor” Sandström, a renowned hardware R&D engineer, extreme overclocker, and founder of Elmor Labs. To better protect the graphics card from potential damage, both Pro versions of the WireView feature a sensor pin detection system that detects, among other things, whether the 12VHPWR power plug from the power supply is correctly inserted.

  
  Another key feature of the Pro versions is the temperature sensors on the PCB, which measure the temperature at the power connectors. The user can define a threshold value on the WireView Pro GPU, which triggers an acoustic alarm when exceeded. Additionally, an alarm can be set to activate when a defined current threshold is exceeded.

  
  The 90° WireView Pro GPU also includes two temperature sensors that can be connected to measure, for example, the temperature of the GPU's memory or voltage regulators.

  
  The 90° WireView Pro GPU is available with the 12VHPWR 16-pin power connector (4x sensor + 12x power/ground) in two versions: "Normal" (N) and "Reverse" (R).
   
  Features of the 90° WireView Pro GPU at a glance:

  • OLED display
  • Power consumption measurement
  • Power usage logging
  • Temperature sensors on power connectors
  • External temperature sensors
  • Sensor pin detection
  • Alarm function
  • NEW: Cable routing toward the bottom of the case
     

  The following values can be displayed on the OLED display of the 90° WireView Pro GPU:

  • Temperature display of power connectors in degrees Celsius [°C]
  • Display of temperatures from optional temperature sensors in degrees Celsius [°C]
  • Current power consumption in watts, current voltage in volts, and current in amperes
  • Minimum and maximum power consumption in watts [W]
  • Average power consumption via the 12VHPWR power cable, averaged over the last 60 seconds [RAVG in W], and total power consumption [E in Wh]
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